Speaker
Description
The heat sink (HS) is a heat exchanger that transfers the heat generated by an electronic or mechanical device to a fluid medium. It prevents damage to electronic equipment by continuously dissipating heat, enabling their sustained advancement and widespread use in applications [1]. In the last decades, researchers pursued different approaches to improve the performance of HS. Ghadhban and Jaffal [2] studied the effect of channel configuration and pressure drop on the thermal performance and characteristics of microchannel heat sinks. Peng et al. [3-4] investigated the influence of geometric parameters on the heat transfer efficient of rectangular microchannels. They observed an optimal result were obtained under fixed height and total cross-sectional area. Arif et al. [5] explored the influence of the thermal interface between fin and base plate in pin-fin heat sinks, considering various interface geometries and contact properties. In order to further improve HS efficiency, more scientific work is required. The current work focused on the channel geometric structure (wavy-shaped and rectangular-shaped geometry) and fluid inlet velocity effects on the thermal performance and pressure drop characteristics of the mini-channel HS. The effects of heat flux generated at the hotspot and background on channel HS efficiency are also included in this work. Conjugate heat transfer and fluid flow analysis in HS were implemented using Comsol Multiphysics. The current simulation results of the heat sink were compared with the state of the arts and the obtained findings were presented and discussed.
Acknowledgment
This work has been supported by a grant from the Ministry of Science and Higher Education in Poland: 0612/SBAD/3628 (2024-25). Simulations were carried out at the Institute of Applied Mechanics, Poznan University of Technology (website: http://am.put.poznan.pl/en/home/).
References
[1] H. T. Dhaiban and M. A. Hussein, JACM, vol. 6, no. 4, pp. 1030–1043, 2020.
[2] F. N. Ghadhban and H. M. Jaffal, Results in Engineering, vol. 17, p. 100839, 2023.
[3] X. Peng, et al., International journal of heat and mass transfer, vol. 38, no. 1, pp. 127–137, 1995.
[4] B. Burlaga et al., Materials, vol. 15, no. 19, p. 6545, 2022.
[5] A. Arif et al., Journal of Electronic Packaging, vol. 134, no. 4, p. 041005, 2012.
