Speaker
Description
In recent years, simulation and scientific computation of electroplating processes are of growing importance to address the increasing requirements on the layer properties. In particular, the current-density and coating-thickness distributions on the electrodes are of special interest and are modelled via couplings between (quasi)static electric fields, transport processes and fluid dynamics. Due to non-linear couplings between transport processes and (quasi)static electric fields and nonlinear boundary conditions, the modelling and numerical treatment turn out to be challenging for this field of study. The talk gives an overview of the state of the art and the related challenges as well as the current limitations in modeling electroplating processes. The talk will discuss possible strategies and concepts to overcome the challenges and limitations of state-of-the-art models as well as the potential of scientific computing and numerical analysis in this area of research.